Years in industry(18)
Automotive Electronics Dispensing Solutions
Second Intelligent provides fluid applications and solutions in the automotive electronics field. Our products can be used in new energy electronic control system glue dispensing, electronic control system CIPG/FIPG dispensing process (sealing dispensing), power device thermal paste dispensing process (heat dissipation)
Cipg-Fipg Dispensing Application
Cipg And Fipg Dispensing Applications Are Mainly Used In Modern Industrial Manufacturing For Sealing Structure Design Between Parts. These Two Processes Have Their Own Characteristics And Are Suitable For Different Scenarios And Needs.
Cipg Dispensing Application
Cipg (Cured In Place Gasket) Technology, Also Known As "Dry Assembly Method", Uses Fully Automatic Dispensing Equipment To Dispense Glue On One Side Of The Workpiece, And Then Assembles After The Glue Is Completely Cured. This Process Achieves A Sealing Effect By Squeezing The Silicone Strips Between The Parts.
The Characteristics Of The Cipg Process Include:
Compression Seal: Sealing Protection Is Achieved By Mechanical Locking. Removability: The Seal Can Be Disassembled At Any Time For Easy Maintenance And Replacement.
Automation: Replace Manual Labor With Accurate Dispensing And Assembly To Improve Production Efficiency And Precision.
Adjustable Locking Force: The Locking Force Can Be Adjusted As Needed To Meet Different Sealing Requirements
Fipg Dispensing Application
Fipg (Formed In Place Gasket) Technology, Also Known As "Wet Assembly Method", Uses Automated Equipment To Assemble The Workpiece Immediately After Dispensing, And Then Bonds The Two Substrates At The Same Time After The Glue Is Cured, Achieving A Reliable Sealing Effect Through Bonding.
The Characteristics Of The Fipg Process Include: Bonding Seal: Sealing Is Achieved Through Bonding, Which Is Suitable For Various Structural Parts.
Simple Process: Reduces Processing And Manufacturing Costs. Widely Applicable: Applicable To Various Structural Parts, Reducing The Risk Of Excessive Local Stress.
Comparison Of Applicable Scenarios And Advantages And Disadvantages
Cipg: Applicable To Occasions That Require Frequent Disassembly And Maintenance, Because Its Detachability Facilitates Maintenance. In Addition, The Cipg Process Can Achieve High-Precision Dispensing And Assembly Through Automated Equipment, Improving Production Efficiency.
Fipg: Applicable To Occasions That Require Highly Reliable Sealing, Especially Those Sealing Structures That Are Not Easy To Disassemble Or Require Long-Term Stability. The Fipg Process Is Simple, Reduces Production Costs, And Can Reduce The Risk Of Excessive Local Stress.
Consumer Electronics Industry Equipment Solutions
Second Intelligent desktop glue dispensing machines and precision glue dispensing equipment are widely and diversely used in the consumer electronics industry, mainly including the following aspects: component bonding and fixing (mobile phone manufacturing, tablet manufacturing, wearable device manufacturing), packaging protection (chip packaging, electronic component packaging), display manufacturing (liquid crystal display (LCD) manufacturing, organic light-emitting diode display (OLED) manufacturing), keyboard manufacturing, headphone manufacturing, etc.;
Desktop dispensing machines, with their high precision and high efficiency, play an important role in many fields of the consumer electronics industry, providing strong support for improving product quality and production efficiency. Dispensing machines play a vital role in the consumer electronics industry. They not only improve the performance and quality of products, but also promote the development of consumer electronic products towards lighter, more durable and higher performance.
AR Equipment Overall Solutions
In the production process of VR (virtual reality) equipment, Second Intelligent precision dispensing machines play a key role, providing high-precision and high-stability dispensing processes for core components such as optical lenses, sensors, and PCB boards. Our dispensing solutions can accurately control the amount of glue, achieve uniform coating of tiny gaps, and ensure the sealing, shock resistance, and long-term reliability of VR equipment. Whether it is flexible dispensing, UV curing, or automated dispensing integration, we provide stable and efficient precision dispensing support for VR equipment manufacturing. We can provide customized solutions to help VR manufacturers improve yield and production efficiency.
Typical application cases:
Optical module packaging – precise dispensing to avoid overflow and affect the image quality
Sensor fixation – high viscosity glue dispensing to enhance structural stability
FPC flexible circuit board bonding – fine dispensing to prevent short circuit or falling off
Automated production line integration – cooperate with manipulators to achieve efficient mass production
Sealing bonding process,Component encapsulation process,PCBA conformal coating process,Battery protection board bonding, Battery pack protection process, IC protection process,
Heat dissipation process, Frame bonding process,Lens shading process,Camera module dispensing process,Camera assembly dispensing process, etc.